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Funding opportunity addresses key manufacturing challenges to enable transition of hybrid electronics into defense, commercial markets.
June 10, 2024
By: DAVID SAVASTANO
Editor, Ink World Magazine
NextFlex, the Department of Defense (DoD) sponsored Manufacturing Innovation Institute focused on maturing hybrid electronics, released Project Call 9.0 (PC 9.0), its latest call for proposals that seek to fund projects that further the development and adoption of hybrid electronics while addressing key challenges in advanced manufacturing. The total PC 9.0 project value is expected to exceed $11 million (including NextFlex investment and performer cost-share), bringing the total anticipated ...
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